FY2009 NOFA
Healthy Homes Technical Studies Program

Purpose

To fund technical studies to improve existing methods for detecting and controlling housing-related health and safety hazards, to develop new methods to detect and control these hazards, and to improve our knowledge of housing-related health and safety hazards.

Type of Assistance

Funds made available under this program are awarded competitively on an annual basis through a selection process conducted by HUD. Funds are awarded in the form of cooperative agreements.

Available Funds

Approximately $4 million is available for award.

Eligible Applicants

Academic and non-profit institutions located in the United States, state and units of general local government, and federally recognized Native American tribes are eligible under all existing authorizations. For-profit firms also are eligible; however, they are not allowed to earn a profit from the project. Applications to supplement existing projects are eligible to compete with applications for new awards. Federal agencies are not eligible to submit applications. The FY 2009 General Section identifies threshold requirements that must be met for an organization to receive an award.

Funding Information

Required Forms

Rating Factors

There are five rating factors that will be used to evaluate and rate your application. They are:

  • Capacity of the Applicant and Relevant Organizational Experience
  • Need and Extent of the Problem
  • Soundness of Approach
  • Leveraging Resources
  • Achieving Program Results and Evaluation
Please refer to the NOFA for further clarification.

Application Process

Applicants must submit their application by MAIL. The address is provided in the NOFA. The eGrants.gov application system will not be used for the Notice of Funding Announcement.

If you have questions, you may contact:

For programmatic questions: Peter.J.Ashley@hud.gov, 202-402-7595.

For administrative questions: Curtissa.L.Coleman@hud.gov, 202-402-7580.

For both: TTY: 1-800-877-8339, fax: 202-755-1000; mailing address: At the bottom of this Web page.

 

 
Content Archived: December 15, 2010